Broadcom has announced new technology designed to enhance the speed and memory capacity of its custom chips, aiming to meet the rising demand for generative AI infrastructure. The innovation, called 3.5D XDSiP, leverages advanced packaging techniques from chip manufacturing giant TSMC to directly link critical components, improving chip performance.
The California-based company, a key player in AI-supporting hardware, expects to ship products using this technology by February 2026. Analysts believe major tech firms like Google and Meta are among Broadcom’s custom-chip clients, as they scale AI clusters to keep pace with demand. Competitor Marvell is also vying for a share of the custom chip market, projected to reach $45 billion by 2028.
Broadcom forecasts $12 billion in AI-related revenue for fiscal year 2024, reflecting the booming industry growth.
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